Important materials for dioma silicon oil -automotive electronic component!(1)

It is estimated that 85%of all automotive applications are related to electrical or electronics. As the electromechanical is gradually replacing traditional machinery and hydraulic functions, and consumers' requirements for new added value, some experts believe that the value of each vehicle's electronic technology can reach an average of 40%in the short time, and ten years ago, people still returned ten years ago. Think of this impossible. Unfortunately, the failure rate caused by electrical/electronic faults is also on the rise, which prompts OEM and level 1 -level providers to adopt harsh reliability standards, so that many manufacturers strive to seek new materials and new designs that change this trend.

Heat (especially when high humidity and other adverse environmental conditions are also existed at the same time) often cause components to fail. When the temperature fluctuates in large range (the most common situation in automotive applications), the joints and components will experience fatigue caused by thermal expansion and contraction, causing mechanical failure. Metal branches -like crystals can grow in the compact space between traces of the circuit board, which eventually causes short circuit and components to fail. People also find that the reliability and life of semiconductor devices depend on the temperature of the connection point. The temperature decreases by 10-15 ° C to increase the life span of the component.

Limitation of traditional chemical materials

Traditional electronic equipment materials are used to improve the reliability of automotive electronics, including extensive chemical materials and applications. Materials are usually epoxy resin, polyurethane rubber, polyetite (PIB), and dysformin and acrylic acid. Each material has its unique advantages and limitations. Applications include adhesives, sealing, coating, gel, sealing agent and thermal conductivity. They usually bond with different substrates. They can solidify at room temperature or heating. But if they are used in high -temperature environments for a long time, their performance will be limited. However, most of them are difficult to cope with these high temperature environments, especially high humidity environments, and are not easy to repair. Lack of the ability to reduce the stress caused by the expansion and shrinkage during the heat shock. Its use.

New Materials of Organic Silicon -Polymailing Siliconoxane

In the electronics industry, silicon is often used as a general term for different aggregate materials. Most commercial silicon formulas are based on PDMS (polymailing siliconane) molecular formula. Electronic component manufacturers provide organic silicon formulas with adhesives, sealing agents, sealing, gel, coating, thermal management materials, and even component packaging materials and semiconductor coatings. In addition, silicon is the basic material of organic silicon. Pure silicon is a semiconductor metal and is the main material of most active semiconductor elements.

Organic silicon chemistry provides a series of different protective materials, including tough, friction -resistant bullet plastic coatings and softness, eliminating stress elastomer products. Circuit board manufacturers can choose a series of room temperature curing (RTV) materials (room temperature curing materials can be accelerated at medium temperature), and can also specify the armal curing formula suitable for high -speed processing. The performance of organic silicon makes car electronics components have higher reliability and longer life. These properties include: thermal stability, elasticity, humidity resistance, adhesion to commonly used substrates, low ion impurities, and compatibility with processing technology.